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Following are just some of the companies/agencies who realized benefits from participating in the GIDEP program. Many of the testimonials below indicate benefits such as cost avoidance and quality assurance.
GIDEP Document Number: X1-4029-05
Document Title: LEAD-FREE SOLDER BUMP TECHNOLOGIES FOR FLIP-CHIP PACKAGING APPLICATIONS
Document Type: ENGINEERING REPORTS
Benefit from this document:
SOLDER ALLOY DESIGN CHANGE
Total Expenditure Prevention: $65,000.00
Look at just some Success Stories!
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